Fluon+ ADHESIVE are fluorinated adhesive resins made with Fluon ETFE or PFA. They are used in applications requiring strong adhesion to plastics and metals. These compounds also exhibit high permeation resistance to many fluids and gases, especially automotive fuels.
Applications
Main Product Types
Standard resin
| Properties | Unit | LH-8000 | AH-5000 | AH-2000 | AH-800 | AH-700 | EA-2000 |
|---|---|---|---|---|---|---|---|
| MFR | g / 10min | 4 | 26 | 25 | 25 | 13 | 16 |
| Specific gravity | - | 1.75 | 1.76 | 1.78 | 1.73 | 1.73 | 2.13 |
| Melting point | °C | 190°C | 225°C | 245°C | 255°C | 258°C | 300°C |
Conductive resin
| Properties | Unit | AH-600C | AH-3000L | AH-800C | AH-700C |
|---|---|---|---|---|---|
| MFR | g / 10min | 4 | 6.5 | 5.5 | 2 |
| Specific gravity | - | 1.76 | 1.77 | 1.75 | 1.75 |
| Melting point | °C | 230°C | 240°C | 255°C | 258°C |
Adhesive Fluon+ EA-2000 resin is drawing a lot of attention as a material for 5G-compatible printed circuit boards that are used in higher frequency bands. While retaining the excellent inherent characteristics of fluoropolymers such as heat resistance and electrical characteristics, Fluon+ EA-2000 provides superior adhesion, which enhances processing capabilities and the reliability of printed circuit boards.
In addition, Fluon+ EA-2000 makes it possible to enhance the electrical characteristics of materials by being overlayed or dispersed on other materials.
Main Product Types
| Products | Features |
|---|---|
| Fluon+ EA-2000 Film | Thickness: 12μm 25μm 38μm 50μm 75μm |
| Fluon+ EA-2000 Powder | Particle size D50: 2~3μm (10kg/package) |
| Fluon+ EA-2000 Dispersion | Solvent: NMP , Solid content: 50wt% (15kg/package) |
Features
- Low dielectric constant (2.0) and low dissipation factor (0.001)
- Excellent adhesion to smooth copper foils – Minimize loss and delay for high frequency applications due to the skin effect
- Stable dielectric constant versus temperature and frequency
- Very low moisture uptake (0.03%)
Applications
Material for CCL/FCCL:
- Automotive radar applications
- 5G cellular telecommunication systems – power amplifiers and antennas
- Other mmWave applications
Adhesiveness toward copper foil
| Roughness (Rz) | Peeling strength (kN/m) | |
|---|---|---|
| Electrolytic copper foil (ED) | 1.2um | 1.5 |
| Rolled copper foil (RA) | 0.4um | 1.2 |
Dk and Df
Comparison of transmittance loss in
high-frequency area
15% loss @28GHz
17% loss @28GHz